Walk into any room of innovators, and the first reaction when they see our technology is always the same: “Wow – this is totally different”. 

And they’re right. FlexICs aren’t just a new kind of chip – they represent a complete rethink of what’s possible in electronics. Instead of rigid, brittle wafers of silicon, our circuits are built on flexible polymer – a lightweight, ultra-thin material that flexes without breaking. It’s a semiconductor you can shape to fit your imagination. 

Rethinking what’s possible 

Silicon has powered decades of progress, revolutionising the way we live, work and play – but it does come with limits. Traditional chips are flat, rigid, and take a long time to manufacture. Production is also resource-heavy, giving them an outsized environmental impact. 

What’s exciting about FlexICs is that they break free from those constraints, delivering high-density intelligence in a form that’s flexible and fast to produce. And because they’re made at low temperatures, they have carbon footprint that’s orders of magnitude lower than a standard chip.  

That unique combination of factors opens the door to a new generation of design possibilities: 

  • Wearables that move naturally with the body 
  • Augmented reality devices where foldable frames and lightweight materials are essential 
  • Everyday objects that use this ultra-thin, flexible intelligence to connect, sense, and compute. 

The first time I held one of our wafers in my hand, and it bent and flexed like film, I realised I was looking at the future. Because where silicon struggles to bend, FlexICs flow. They enable seamless connections even on curved surfaces, giving engineers the tools to solve problems that once seemed impossible. 

Innovation at speed and scale 

FlexICs aren’t just more adaptable; they’re faster to produce. Traditional silicon manufacturing can take months from design to delivery. Our process – literally layering thin-film transistors onto polymer – slashes production time and cost. And we can do this at scale, producing billions of chips per year. It’s a completely different way of thinking about semiconductors, and it puts innovation back in the hands of designers and innovators. 

Customers seeing FlexICs for the first time often experience an “Aha!” moment: that instant realisation that this technology doesn’t just compete with silicon – it complements it, unlocking applications silicon never could. 

Powering the Internet of Everything 

As we shift from an Internet of Things to an Internet of Everything, there’s growing demand for low-cost, low-power intelligence in at item level. These smart items will create the data for AI systems to drive unprecedented levels of insight and efficiency at scale.   

Imagine a world where every package, label, or wearable contains a smart, sustainable chip – where connectivity extends beyond devices to everything from food and drink, apparel, pharmaceuticals and cosmetics – even smart toys and games. 

FlexICs make that world achievable, serving both traditional semiconductor markets and entirely new ones that silicon can’t reach. 

Innovation has always started with imagination. The next wave of innovation belongs to those who dare to imagine more. With FlexICs, that imagination can finally take shape – anywhere, on anything.